logo
Enviar mensaje

Detalles de los productos

Created with Pixso. Hogar Created with Pixso. Productos Created with Pixso.
Cinta de Packaing del semiconductor
Created with Pixso.

KHJ TS651ZF Heat Release Tape Acrylic Adhesive Ultra-Thin Wafer Dicing Delicate Factory Manufacturer

KHJ TS651ZF Heat Release Tape Acrylic Adhesive Ultra-Thin Wafer Dicing Delicate Factory Manufacturer

Marca: KHJ
Número De Modelo: TS651ZF
Información detallada
Lugar de origen:
Porcelana
Certificación:
RoHS
Descripción de producto
PRODUCT DESCRIPTION TS651ZF is a white heat-release adhesive tape with high initial tack. It retains adhesion at elevated temperatures until the adhesive foams and loses tack at 190℃, achieving automatic separation from the substrate. Product Structure Product Features * Initial heat resistance; non-re-tacky * High instantaneous adhesion with precise positioning; components are easily removed after heat debonding, leaving no adhesive residue Product Applications Suitable for